giga-camera and selfie camera under screen’
The Honor Magic 3 has been leaked, an upcoming top device from Honor. We get to see a large camera sensor on the back and a borderless screen with curved edges. The device appears with the new Snapdragon 888 Plus chipset.
Honor Magic 3
Honor is back and now lives on as a brand that works completely independently of Huawei. Recently, the brand introduced its Honor 50 series of budget flagships in China, and it seems that the brand is also targeting Europe this summer. Honor is currently recruiting staff in the Netherlands, Androidworld recently discovered.
However, the brand does not stick to the Honor 50 series, because there is also a premium phone on the way: the Honor Magic 3. That smartphone series has been known for years for progressive designs, such as the slide mechanism of the Magic 2.
It seems that the successor to that phone will again come with a borderless screen, but this time because there is a selfie camera under the panel. Also on the sides we see very small screen edges, and the panel has a very strong bend. In addition, we note that the phone has three cameras with a very large main sensor. Exact specifications are not yet known.
Snapdragon 888 Plus
The renders at the top of this article are from the Chinese tipster Tech Agent who share in a tweet. He immediately mentions that he found the renders at a rumor distributor on the Chinese social media site Weibo, and that he cannot confirm whether they are real. So take the pictures with a grain of salt for now.
What we already know for sure is that the Honor Magic 3 is indeed on the way. Honor recently confirmed this itself with the unveiling of Qualcomm’s Snapdragon 888 Plus. The new top device of the brand will use this powerful chipset. Are you looking forward to the arrival of the first Honor phone since a new wind is blowing at the brand. Let us know in the comments at the bottom of this article.
